| Layer | 1L |
| Base Material | Aluminum |
| Specification | PCB customized size |
| Delivery | 7-10 Days |
| Certification | UL(CUL), IS09001&IS014001, IATF16949, REACH, RoHS, |
| Application | Lighting |
| Transport Package | Vacuum Package and Foam Protected |
Surface treatment | Lead-free HASL、OSP |
Solder Mask | Photosensitive Solder Resist |
| Copper thickness | 0.5-3oz |
| Minimum line width | 0.12mm |
| Minimum line spacing | 0.12mm |
| Minimum drill diameter | 0.7mm |
| Minimum punching diameter | 0.7mm |
| Finished plate thickness range | 0.4-3.0mm |
| Thermal conductivity | 1.0W-2.0W |
| Layer | 1L |
| Base Material | Aluminum |
| Specification | PCB customized size |
| Delivery | 7-10 Days |
| Certification | UL(CUL), IS09001&IS014001, IATF16949, REACH, RoHS, |
| Application | Lighting |
| Transport Package | Vacuum Package and Foam Protected |
Surface treatment | Lead-free HASL、OSP |
Solder Mask | Photosensitive Solder Resist |
| Copper thickness | 0.5-3oz |
| Minimum line width | 0.12mm |
| Minimum line spacing | 0.12mm |
| Minimum drill diameter | 0.7mm |
| Minimum punching diameter | 0.7mm |
| Finished plate thickness range | 0.4-3.0mm |
| Thermal conductivity | 1.0W-2.0W |
